Semiconductor (Packaging & Systems)
Connect Package Behavior to System Performance
Explore how materials, architecture, and operating conditions shape semiconductor performance. SolverX brings Physics Intelligence to the prediction and optimization of interacting physical behavior across chips, packages, and systems, helping your team evaluate more designs and understand performance trade-offs.
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Understand Interactions. Explore More Design Possibilities
Changes in cooling, interfaces, materials, or geometry can affect performance throughout a design. SolverX connects your simulation and test data with fast predictive models, helping your team compare configurations, evaluate thermal, mechanical, fluid, and optical interactions, and work backward from performance targets to design choices.
Applications
01
Thermal Management & Cooling
Evaluate heat transfer and flow across chips, packages, and systems. Explore cooling architectures, thermal interfaces, and operating conditions to understand temperature distributions and cooling performance.
02
Material, Interface & Structural Behavior
Investigate how material properties, interfaces, and loading histories influence stress, deformation, and reliability-related responses. Assess the effects of structural and material choices.
03
Multiphysics Design & Optimization
Explore thermal, mechanical, fluid, and optical behavior. Evaluate physical interactions and identify design combinations that meet component and system requirements.
Explore the Physics Behind Your Next Design
Connect SolverX Physics Intelligence with your simulation and test data. Apply customized prediction and optimization models to the performance goals that matter to your design.
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