Physics Intelligence for Electronics and Home Appliances
Predict thermal, fluid, structural, and electromagnetic responses as designs and manufacturing conditions change. Connect your computational models and experimental data with Physics Intelligence to explore designs for thermal, durability, and process goals.
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Applications
Connect SolverX Physics Intelligence with your computational models and experimental data to predict the physical behavior of electronics and home appliances. Use a solution tailored to your research and design goals to compare geometries, material properties, and operating conditions, and explore designs that meet your performance targets.
Thermal & Cooling Flow
Predict cooling flow and heat transfer to evaluate temperature distributions, hot spots, pressure loss, and cooling performance. Compare heat-source layouts, flow paths, material properties, and operating conditions, and connect the results with thermal deformation analysis where needed.
Packaging Drop & Impact
Evaluate transmitted shock and deformation under drops and transport loads as cushioning properties, packaging geometry, and contact conditions change. Connect your simulation models and test criteria to compare product protection and explore suitable packaging conditions.
Structural Vibration & Fatigue
Predict natural frequencies, mode shapes, vibration response, and stress histories under different excitation, support, and mounting conditions. Connect these results with your fatigue assessment models and test data to compare cyclic loading effects and refine stiffness, mass, and geometry.
Electromagnetics & Coupling
Evaluate electromagnetic fields, forces, and their interactions with thermal and structural behavior using a solution tailored to your computational models and measurements. Explore geometry, material properties, and excitation conditions for the frequency range and performance goals of your application.
Injection Molding & Warpage
Predict filling, pressure, and cooling during injection molding, together with the resulting shrinkage and warpage. Compare geometry, resin properties, and process conditions to explore design and process combinations that meet final dimensional and assembly requirements.
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